Deadline Date: September 16, 2026
The Chips Joint Undertaking (Chips JU) has launched the IA Resilience Call to strengthen Europe’s power electronics ecosystem by supporting innovation across the semiconductor value chain and reinforcing industrial resilience.
The call focuses on Wide Band Gap (WBG) substrates, cost-effective WBG platforms for GaN and SiC, innovation toolboxes including wafer cut, smart stacking, thin layer transfer, epitaxy and UWBG materials, next-generation and optimized power semiconductor devices, intelligent power semiconductor devices with control and sensing capabilities, advanced packaging and integration solutions, heterogeneous and functional integration, advanced characterization techniques for new materials, devices and systems, and the implementation of artificial intelligence at system level to accelerate innovation.
The call supports projects that address Europe’s strategic priorities in power electronics while building on existing initiatives and preparing for future market needs. Proposals are encouraged to engage with the WBG pilot line and create synergies with other pilot lines and Competence Centres established under the Chips Act’s Chips for Europe Initiative.
Participation is open to eligible legal entities established in EU Member States, EEA countries, Associated Countries, OECD countries, and Mercosur countries, subject to the eligibility conditions of the call. The total available budget is €20 million, with grants ranging from €1 million to €10 million per project. The call opened on 7 July 2026, and applications must be submitted by 16 September 2026.
Projects should also contribute to the development of trustworthy electronics that provide secure, reliable, and resilient components and systems. The call aims to improve performance, reliability, robustness, cost competitiveness, and stable power supply while minimizing disruptions, equipment failures, and data corruption across different application sectors.
For more information, visit European Commission.
