Deadline Date: September 24, 2026
The European Commission is now accepting grant applications to support collaborative projects between the European Union and Japan to advance semiconductor technologies.
The programme focuses on developing methods for 2.5D/3D integration, integrated photonics processes, chiplet co-optimization, interface design, through-silicon vias, interposers, bonding techniques, collaboration among material scientists, chemical engineers, semiconductor manufacturers and AI experts, strengthening partnerships across industry, academia and research organizations, advancing semiconductor manufacturing, supporting industrial applications, promoting commercial viability, and contributing to global semiconductor standards.
The programme encourages collaborative projects that strengthen cooperation between the European Union and Japan in semiconductor technologies. It supports the development of advanced semiconductor manufacturing methods while promoting innovation through multidisciplinary collaboration.
Projects are expected to bring together experts from different fields, including material science, chemical engineering, semiconductor manufacturing, and artificial intelligence, to bridge research with industrial applications and encourage wider adoption of innovative technologies.
The programme also promotes partnerships among industry, academia, and research organizations to support technological breakthroughs in semiconductor manufacturing and contribute to the advancement of global semiconductor standards.
A total funding of €5,000,000 is available under this programme, with grant amounts ranging from €3,000,000 to €5,000,000.
Eligible applicants must apply as a consortium consisting of at least three independent legal entities. Legal entities established in EU Member States and EEA countries are eligible to participate, subject to the programme’s participation and security requirements.
For more information, visit European Commission.
