Deadline: September 24, 2026
The focus areas include Europe-Japan collaboration, next-generation semiconductor technologies, artificial intelligence (AI), chiplets, 2.5D/3D integration, integrated photonics, and industrial deployment.
The call aims to strengthen collaboration between Europe and Japan by supporting projects that advance semiconductor technologies for AI. It encourages the development of chiplets, 2.5D/3D integration, and integrated photonics while accelerating industrial deployment.
Innovation Fund Denmark offers co-funding to Danish participants involved in successful projects under this call.
The maximum national funding is €650,000 (approximately DKK 4.8 million) per project when there is more than one Danish partner and €650,000 (approximately DKK 4.8 million) per Danish partner. If the coordinator is a Danish organisation, the maximum national funding is €1,300,000 (approximately DKK 9.7 million) per project and €650,000 (approximately DKK 4.8 million) per Danish partner. The minimum funding amount is €50,000 (approximately DKK 375,000) per partner. EU co-funding is not included in the maximum and minimum national funding amounts.
The call is open to Danish universities, companies, industry organisations, RTOs, and research organisations. All Danish organisations directly involved in project activities are eligible to apply to Innovation Fund Denmark.
For more information, visit Innovation Fund Denmark.
