Deadline Date: September 16, 2026
The European Commission is requesting grant applications to support innovative photonics solutions by enhancing manufacturing capabilities, technological integration, and strategic applications across Europe.
Focus areas include scaling of wafer-level photonic processes for key materials such as SiN, InP, and GaAs; development of scalable, automated packaging and test solutions compatible with co-packaged optics and advanced photonic-electronic integration; integration of heterogeneous materials and components including on-chip lasers, modulators, and detectors; design-process-equipment co-optimisation for cost-effective production of complex photonic circuits and systems; and demonstration of system-level functionality through application-relevant use cases in strategic sectors such as AI, sensing, telecommunication, mobility, health, and defence.
The call supports proposals focused on strengthening photonics manufacturing capabilities through improved process integration, yield optimisation, manufacturability, and advanced assembly approaches.
Projects are expected to demonstrate practical applications with quantified performance metrics and clear market relevance, supporting the development of innovative photonic circuits and systems.
The total available funding for the call is €20,000,000, with individual project funding ranging from €1,000,000 to €10,000,000.
Participation is open to legal entities established in EU Member States, EEA Countries, Associated Countries, OECD countries, and Mercosur countries, according to the eligibility conditions under the HORIZON Europe conditions applicable to the Chips Joint Undertaking.
Entities controlled directly or indirectly from non-eligible countries must meet required guarantees to ensure that participation does not negatively impact the strategic interests, assets, autonomy, or security of the European Union and its Member States.
For more information, visit European Commission.
