Deadline Date: September 16, 2026
The European Commission is seeking applications to strengthen international cooperation in developing advanced semiconductor and integration technologies.
Focus areas include innovative design and integration concepts for neuromorphic computing systems with very low energy consumption, connectivity, and embedded functions for mobile applications; alternative semiconductor chip manufacturing process technologies for frontend and backend heterogeneous integration; and advanced packaging solutions for integrating multiple functions and materials in communication, sensing, actuating, power management, and active/passive integration applications.
The call aims to strengthen collaboration between European and Digital Partnership countries’ research and innovation communities by leveraging complementary expertise in advanced packaging, heterogeneous integration, and photonic chip technologies.
Projects are expected to contribute to semiconductor solutions that support the continued evolution of device performance, miniaturisation, cost efficiency, and reduced environmental impact.
The total available funding for this call is €5,000,000, with individual project funding ranging from €1,000,000 to €5,000,000.
Participation is limited to legal entities established in EU Member States, EEA Countries, Associated Countries, OECD countries, and Mercosur countries according to the eligibility conditions under the HORIZON Europe conditions applicable to the Chips Joint Undertaking.
Entities controlled directly or indirectly from non-eligible countries must provide approved guarantees to ensure that their participation does not negatively affect the strategic interests, assets, autonomy, or security of the European Union and its Member States.
For more information, visit European Commission.
