Deadline Date: May 07, 2026
The Chips for Europe Initiative is seeking applications to support technological capacity building and innovation by accelerating the transfer of advanced packaging technologies from pilot stages to industrial deployment.
The initiative focuses on strengthening technological capacity in electronic components and systems, reinforcing strategic autonomy, accelerating the transfer of advanced packaging technologies from pilot lines to industrial deployment, expanding the European packaging ecosystem, boosting competitiveness, and ensuring resilient supply chains across industries and economic sectors.
They offer co-funding to Danish participants in successful projects, subject to national agreements, while applicants may also qualify for separate EU co-funding based on Chips JU criteria and funding rates. The national co-funding does not include EU contributions, and both funding streams are managed independently.
The funding amount includes a maximum national co-funding of EUR 650,000 per project and per Danish partner, with a minimum threshold of EUR 50,000 per partner. If a Danish organisation acts as the project coordinator, the maximum national co-funding per project increases to EUR 1,300,000, while the per-partner cap remains unchanged.
Funding rates vary between 0% and 55% of the total project costs, depending on the nature of the activities and applicable guidelines. Eligible costs under the programme include salaries, travel, subcontracting, materials, communication and knowledge sharing, other related expenses, and overhead costs. The call is targeted at Danish companies, research organisations, and research and technology organisations directly involved in project activities.
For more information, visit Innovation Fund Denmark.
